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Can Tg be used as a service temperature indicator for the selection of a structural adhesive?

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dc.contributor.author Custódio, J. pt_BR
dc.contributor.author Rodrigues, D. pt_BR
dc.contributor.author Cruz, H. pt_BR
dc.contributor.author Broughton, J. pt_BR
dc.date.accessioned 2010-05-06T15:15:00Z pt_BR
dc.date.accessioned 2014-10-20T15:58:19Z pt_BR
dc.date.accessioned 2017-04-12T16:08:00Z
dc.date.available 2010-05-06T15:15:00Z pt_BR
dc.date.available 2014-10-20T15:58:19Z pt_BR
dc.date.available 2017-04-12T16:08:00Z
dc.date.issued 2008 pt_BR
dc.identifier.isbn 1615670882 pt_BR
dc.identifier.uri https://repositorio.lnec.pt/jspui/handle/123456789/1000130
dc.description.abstract In order to contribute to the ongoing discussion on the reliability of epoxy (EP) and polyurethane (PUR) adhesives for load bearing structures, a study was conducted at LNEC where several structural adhesives were subjected to several temperature regimes and subsequently assessed, namely to compare their glass transition temperature (Tg) with strength and stiffness decrease with increasing service temperature. The results showed that the PUR and EP adhesives display significantly different viscoelastic responses over the temperature ranges attained normally in service. Thus temperature-induced creep is a risk factor that needs to be considered cautiously when approving novel adhesive types for structural applications. The study of the specific components and formulations of the various adhesives studied, showed that the resultant strength and temperature stability varied greatly. Because of that, careful adhesive selection, considering its glass transition temperature, thermal performance and possibly a post-cure procedure, should be made. pt_BR
dc.language.iso eng pt_BR
dc.publisher Engineered Wood Products Association (Ewpa) pt_BR
dc.rights openAccess pt_BR
dc.title Can Tg be used as a service temperature indicator for the selection of a structural adhesive? pt_BR
dc.type conferenceObject pt_BR
dc.identifier.seminario 10th World Conference on Timber Engineering – WCTE 2008 pt_BR
dc.identifier.local Miyazaki, Japão pt_BR
dc.description.sector DM/NB pt_BR
dc.description.year 2008 pt_BR
dc.description.data 2 a 5 de Junho pt_BR


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